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主な生産パッケージ一覧

新たなパッケージング技術についてはこちら

USB-A(Ultra Small Board:ノンリード・ガラエポ基板)
pin package size
(mm)
lead pitch
(mm)
substrate
(lead frame)
max. chip size
(mm)
data sheet
(PDF)
sample
4 2.10 x 1.40 x t0.60 0.65 glass epoxy 1.10 x 0.76 x t0.20    
4 1.30 x 0.90 x t0.55 0.50 glass epoxy 0.60 x 0.60 x t0.15    
4 1.50 x 2.00 x t0.65 0.80 glass epoxy 0.53 x 0.53 (2chip)    
6 2.00 x 1.80 x t0.85 0.50 glass epoxy 1.00 x 1.40 x t0.27 USB6A0.85  
6 2.00 x 1.80 x t0.70 0.50 glass epoxy 1.00 x 1.40 x t0.25 USB6A0.70 image
10 2.00 x 2.80 x t0.80 0.50 glass epoxy 1.00 x 2.40 x t0.28 USB10A0.80  
USB-B(Ultra Small Board:ノンリード・Ni電鋳転写リード)
pin package size
(mm)
lead pitch
(mm)
substrate
(lead frame)
max. chip size
(mm)
data sheet
(PDF)
sample
3 1.20 x 1.20 x t0.60 0.60 (Ni) electro-
forming
0.54 x 0.84 x t0.20 USB3B0.60  
4 1.20 x 1.60 x t0.60 0.60 (Ni) electro-
forming
0.60 x 0.80 x t0.25 USB4B0.60  
6 2.00 x 1.80 x t0.60 0.50 (Ni) electro-
forming
0.82 x 1.22 x t0.20 USB6B0.60  
6 2.00 x 1.80 x t0.70 0.50 (Ni) electro-
forming
0.82 x 1.22 x t0.20 USB6B0.70  
10 2.60 x 2.90 x t0.60 0.50 (Ni) electro-
forming
1.40 x 2.30 x t0.21 USB10B0.60  
12 2.30 x 2.80 x t0.60 0.40 (Ni) electro-
forming
1.10 x 1.00 x t0.20
(Ag paste)
USB12B0.60  
12 2.30 x 2.80 x t0.60 0.40 (Ni) electro-
forming
1.30 x 1.10 x t0.25
(dielectric:絶縁)
USB12B0.60  
USB-C(Ultra Small Board:ノンリード・Cu frame)
pin package size
(mm)
lead pitch
(mm)
substrate
(lead frame)
max. chip size
(mm)
data sheet
(PDF)
sample
4 1.40 x 1.20 x t0.35 0.50 Cu 0.82 x 0.90 x t0.10 USB4C0.35  
4 1.40 x 1.20 x t0.40 0.50 Cu 0.82 x 0.90 x t0.10 USB4C0.40  
4 1.40 x 1.20 x t0.60 0.50 Cu 0.82 x 0.90 x t0.15    
6 2.00 x 1.80 x t0.70 0.50 Cu 1.25 x 1.45 x t0.15   image
8 5.00 x 4.50 x t0.75 1.00 Cu 2.50 x 3.50 x t0.25 USB8C1.00  
LNC(Lead Number Choose:ノンリード・ガラエポ基板)
pin package size
(mm)
lead pitch
(mm)
substrate
(lead frame)
max. chip size
(mm)
data sheet
(PDF)
sample
4 2.85 x 1.15 x t0.75 0.65 glass epoxy 1.85 x 0.75 x t0.25    
6 2.85 x 1.80 x t0.75 0.65 glass epoxy 1.85 x 1.40 x t0.25 LNC6A  
8 2.85 x 2.45 x t0.65 0.65 glass epoxy 1.85 x 2.05 x t0.25   image
10 2.85 x 3.10 x t0.80 0.65 glass epoxy 1.85 x 2.70 x t0.25    
12 2.85 x 1.80 x t0.80 0.65 glass epoxy 1.80 x 3.35 x t0.25   image
14 2.85 x 4.40 x t0.80 0.65 glass epoxy 1.85 x 4.00 x t0.25    
QFN(Quad Flat Non-leaded:ノンリード・ガラエポ基板)
pin package size
(mm)
lead pitch
(mm)
substrate
(lead frame)
max. chip size
(mm)
data sheet
(PDF)
sample
6 1.00 x 1.20 x t0.45 0.80 glass epoxy 0.70 x 0.50 x t0.13 QFN6A0.45  
6 2.00 x 1.80 x t0.45 0.80 glass epoxy 0.68 x 1.22 x t0.13    
8 1.50 x 1.50 x t0.60 0.50 glass epoxy 0.80 x 0.80 x t0.25 QFN8A0.60 image
8 1.50 x 1.50 x t0.80 0.50 glass epoxy 0.80 x 0.80 x t0.25 QFN8A0.80  
10 1.50 x 2.00 x t0.80 0.50 glass epoxy 0.80 x 0.80 x t0.30 QFN10A0.60 image
12 2.35 x 2.35 x t0.80 0.50 glass epoxy 1.65 x 1.65 x t0.30 QFN12A0.80 image
16 2.85 x 2.85 x t0.80 0.50 glass epoxy 1.95 x 1.95 x t0.25 QFN16A0.80  
MCM(Multi Chip Module:ノンリード・ガラエポ基板)
pin package size
(mm)
lead pitch
(mm)
substrate
(lead frame)
max. chip size
(mm)
data sheet
(PDF)
sample
20 4.30 x 4.60 x t0.80 0.60 glass epoxy 1.40 x 1.90 x t0.20    
20 4.30 x 4.60 x t0.80 0.60 glass epoxy 0.85 x 0.85 x t0.20    
20 4.30 x 4.60 x t0.80 0.60 glass epoxy 1.10 x 1.10 x t0.20    
DFN(Dual Flat No Lead:ノンリード・Cu frame)
pin package size
(mm)
lead pitch
(mm)
substrate
(lead frame)
max. chip size
(mm)
data sheet
(PDF)
sample
6 1.20 x 1.20 x t0.40 0.40 Cu 0.52 x 1.00 x t0.10 DFN6C0.40  
SOT-23(リードパッケージ・Cu frame)
pin package size
(mm)
lead pitch
(mm)
substrate
(lead frame)
max. chip size
(mm)
data sheet
(PDF)
sample
3 1.60 x 2.90 x t1.10 1.90 Cu 1.00 x 1.00 SOT23 image
5 1.60 x 2.90 x t1.10 0.95 Cu 1.30 x 1.00 SOT25 image
6 1.60 x 2.90 x t1.10 0.95 Cu 1.30 x 0.80 SOT26  
6w 1.80 x 2.90 x t1.10 0.95 Cu 1.30 x 1.00 SOT26W image
SOT-89(リードパッケージ・Cu frame)
pin package size
(mm)
lead pitch
(mm)
substrate
(lead frame)
max. chip size
(mm)
data sheet
(PDF)
sample
3 2.50 x 4.50 x t1.50 1.50 Cu 1.50 x 1.30 SOT89-3 image
5 2.50 x 4.50 x t1.50 1.50 Cu 1.50 x 1.30 SOT89-5 image
SOP(リードパッケージ・Cu frame)
pin package size
(mm)
lead pitch
(mm)
substrate
(lead frame)
max. chip size
(mm)
data sheet
(PDF)
sample
8 4.40 x 5.20 x t1.50
(C type)
1.27 Cu 3.60 x 2.10 SOP8C image
8 4.40 x 5.20 x t1.50
(D type)
1.27 Cu 3.60 x 2.10 SOP8D
8 4.40 x 5.20 x t1.50
(F type)
1.27 Cu 3.60 x 2.10 SOP8F
8 3.9 x 6.0 x 1.6 1.27 Cu - 8-SOIC image
16 4.4 x 6.4 x 1.0 0.65 Cu - 16-TSSOP image
20 4.40 x 6.4 x 1.1 0.65 Cu - 20-TSSOP image
24 5.3 x 7.9 x 1.9 0.65 Cu - 24-SSOP image
24 5.6 x 7.6 x 1.1 0.65 Cu - 24-TSSOP image
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